XCV1000-6BGG560C
vs
XQV1000E-6BGG560N
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
BGA
|
|
Package Description |
LBGA,
|
PLASTIC, BGA-560
|
Pin Count |
560
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
|
Clock Frequency-Max |
333 MHz
|
357.2 MHz
|
Combinatorial Delay of a CLB-Max |
0.6 ns
|
0.47 ns
|
JESD-30 Code |
S-PBGA-B560
|
S-PBGA-B560
|
JESD-609 Code |
e1
|
e1
|
Length |
42.5 mm
|
42.5 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
6144
|
6144
|
Number of Equivalent Gates |
1124022
|
1569178
|
Number of Terminals |
560
|
560
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
6144 CLBS, 1124022 GATES
|
6144 CLBS, 1569178 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Supply Voltage-Max |
2.625 V
|
1.89 V
|
Supply Voltage-Min |
2.375 V
|
1.71 V
|
Supply Voltage-Nom |
2.5 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
MILITARY
|
Terminal Finish |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
42.5 mm
|
42.5 mm
|
Base Number Matches |
1
|
2
|
Number of Logic Cells |
|
27648
|
|
|
|
Compare XCV1000-6BGG560C with alternatives