XCV50E-7CS144C vs XCV50E-6CS144C feature comparison

XCV50E-7CS144C AMD Xilinx

Buy Now Datasheet

XCV50E-6CS144C AMD Xilinx

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description CSP-144 TFBGA, BGA144,13X13,32
Pin Count 144 144
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 400 MHz 357 MHz
Combinatorial Delay of a CLB-Max 0.42 ns 0.47 ns
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e0 e0
Length 12 mm 12 mm
Moisture Sensitivity Level 3 3
Number of CLBs 384 384
Number of Equivalent Gates 20736 20736
Number of Inputs 94 94
Number of Logic Cells 1728 1728
Number of Outputs 94 94
Number of Terminals 144 144
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 384 CLBS, 20736 GATES 384 CLBS, 20736 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA144,13X13,32 BGA144,13X13,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 240 240
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 12 mm 12 mm
Base Number Matches 1 1

Compare XCV50E-7CS144C with alternatives

Compare XCV50E-6CS144C with alternatives