XCV800-4FG680C vs XCV800-5FGG680I feature comparison

XCV800-4FG680C AMD Xilinx

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XCV800-5FGG680I AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-680 LBGA,
Pin Count 680 680
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 250 MHz 294 MHz
Combinatorial Delay of a CLB-Max 0.8 ns 0.7 ns
JESD-30 Code S-PBGA-B680 S-PBGA-B680
JESD-609 Code e0 e1
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 4704 4704
Number of Equivalent Gates 888439 888439
Number of Inputs 512
Number of Logic Cells 21168
Number of Outputs 512
Number of Terminals 680 680
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 4704 CLBS, 888439 GATES 4704 CLBS, 888439 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA680,39X39,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 40 mm
Base Number Matches 1 1

Compare XCV800-4FG680C with alternatives

Compare XCV800-5FGG680I with alternatives