XCV812E-6FG900C vs XCV812E-6FGG900C feature comparison

XCV812E-6FG900C AMD Xilinx

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XCV812E-6FGG900C AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, FBGA-900 BGA,
Pin Count 900 900
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 357 MHz 357 MHz
Combinatorial Delay of a CLB-Max 0.47 ns 0.47 ns
JESD-30 Code S-PBGA-B900 S-PBGA-B900
JESD-609 Code e0 e1
Length 31 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 4704 4704
Number of Equivalent Gates 254016 254016
Number of Inputs 556
Number of Logic Cells 21168
Number of Outputs 556
Number of Terminals 900 900
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4704 CLBS, 254016 GATES 4704 CLBS, 254016 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm 31 mm
Base Number Matches 1 1

Compare XCV812E-6FG900C with alternatives

Compare XCV812E-6FGG900C with alternatives