XCV812E-7FGG900C vs XCV812E-8FG900I feature comparison

XCV812E-7FGG900C AMD Xilinx

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XCV812E-8FG900I AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, PLASTIC, FBGA-900
Pin Count 900 900
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 400 MHz 416 MHz
Combinatorial Delay of a CLB-Max 0.42 ns 0.4 ns
JESD-30 Code S-PBGA-B900 S-PBGA-B900
JESD-609 Code e1 e0
Length 31 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 4704 4704
Number of Equivalent Gates 254016 254016
Number of Terminals 900 900
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4704 CLBS, 254016 GATES 4704 CLBS, 254016 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm 31 mm
Base Number Matches 1 1
Number of Inputs 556
Number of Logic Cells 21168
Number of Outputs 556
Package Equivalence Code BGA900,30X30,40

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