XCV812E-7FGG900I
vs
XCV812E-7FGG900C
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
BGA,
|
Pin Count |
900
|
900
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
400 MHz
|
400 MHz
|
Combinatorial Delay of a CLB-Max |
0.42 ns
|
0.42 ns
|
JESD-30 Code |
S-PBGA-B900
|
S-PBGA-B900
|
JESD-609 Code |
e1
|
e1
|
Length |
31 mm
|
31 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
4704
|
4704
|
Number of Equivalent Gates |
254016
|
254016
|
Number of Terminals |
900
|
900
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
4704 CLBS, 254016 GATES
|
4704 CLBS, 254016 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.6 mm
|
2.6 mm
|
Supply Voltage-Max |
1.89 V
|
1.89 V
|
Supply Voltage-Min |
1.71 V
|
1.71 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
31 mm
|
31 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare XCV812E-7FGG900I with alternatives
Compare XCV812E-7FGG900C with alternatives