XCVU095-1FFVB1760E vs XCVU095-1FFVB1760I feature comparison

XCVU095-1FFVB1760E AMD Xilinx

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XCVU095-1FFVB1760I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2017-02-15
JESD-609 Code e1 e1
Moisture Sensitivity Level 4 4
Peak Reflow Temperature (Cel) 245 245
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 1 1
Package Description BGA-1760
ECCN Code 3A001.A.7.B
JESD-30 Code S-PBGA-B1760
Length 42.5 mm
Number of CLBs 768
Number of Inputs 832
Number of Logic Cells 1176000
Number of Outputs 832
Number of Terminals 1760
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 768 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 3.81 mm
Supply Voltage-Max 0.979 V
Supply Voltage-Min 0.922 V
Supply Voltage-Nom 0.95 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm

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Compare XCVU095-1FFVB1760I with alternatives