XCVU095-1FFVD1517I vs XCVU095-1FFVB1760I feature comparison

XCVU095-1FFVD1517I AMD Xilinx

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XCVU095-1FFVB1760I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description BGA-1517 BGA-1760
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.7.B 3A001.A.7.B
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B1517 S-PBGA-B1760
JESD-609 Code e1 e1
Length 40 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of CLBs 768 768
Number of Inputs 832 832
Number of Logic Cells 1176000 1176000
Number of Outputs 832 832
Number of Terminals 1517 1760
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 768 CLBS 768 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1517,39X39,40 BGA1760,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 3.51 mm 3.81 mm
Supply Voltage-Max 0.979 V 0.979 V
Supply Voltage-Min 0.922 V 0.922 V
Supply Voltage-Nom 0.95 V 0.95 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 42.5 mm
Base Number Matches 1 1

Compare XCVU095-1FFVD1517I with alternatives

Compare XCVU095-1FFVB1760I with alternatives