XCVU11P-1FLGA2577E vs XCVU11P-1FLGB2104I feature comparison

XCVU11P-1FLGA2577E AMD Xilinx

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XCVU11P-1FLGB2104I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.B 3A001.A.7.B
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2016-06-03 2016-06-03
JESD-30 Code S-PBGA-B2577 S-PBGA-B2104
Length 52.5 mm 47.5 mm
Number of CLBs 162000 162000
Number of Inputs 624 624
Number of Logic Cells 2835000 2835000
Number of Outputs 624 624
Number of Terminals 2577 2104
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C
Organization 162000 CLBS 162000 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA2577,51X51,40 BGA2104,46X46,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 4.24 mm 4.32 mm
Supply Voltage-Max 0.876 V 0.876 V
Supply Voltage-Min 0.825 V 0.825 V
Supply Voltage-Nom 0.85 V 0.85 V
Surface Mount YES YES
Temperature Grade OTHER INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 52.5 mm 47.5 mm
Base Number Matches 1 1
Package Description BGA-2104

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