XCVU11P-1FLGB2104E
vs
XCVU11P-1FLGF1924E
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
XILINX INC
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| Samacsys Manufacturer |
AMD
|
|
| JESD-30 Code |
S-PBGA-B2104
|
S-PBGA-B1924
|
| Length |
47.5 mm
|
45 mm
|
| Number of CLBs |
162000
|
162000
|
| Number of Inputs |
624
|
624
|
| Number of Logic Cells |
2835000
|
2835000
|
| Number of Outputs |
624
|
624
|
| Number of Terminals |
2104
|
1924
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
|
|
| Organization |
162000 CLBS
|
162000 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA2104,46X46,40
|
BGA1924,44X44,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
4.32 mm
|
4.24 mm
|
| Supply Voltage-Max |
0.876 V
|
0.876 V
|
| Supply Voltage-Min |
0.825 V
|
0.825 V
|
| Supply Voltage-Nom |
0.85 V
|
0.85 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
47.5 mm
|
45 mm
|
| Base Number Matches |
2
|
2
|
| Package Description |
|
BGA-1924
|
| ECCN Code |
|
3A001.A.7.B
|
| HTS Code |
|
8542.39.00.01
|
| Date Of Intro |
|
2016-06-03
|
| JESD-609 Code |
|
e1
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
|
|
|
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