XCVU11P-1FLGC2104E vs XCVU11P-1FLGA2577E feature comparison

XCVU11P-1FLGC2104E AMD

Buy Now Datasheet

XCVU11P-1FLGA2577E AMD Xilinx

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Reach Compliance Code not_compliant not_compliant
Factory Lead Time 20 Weeks
JESD-30 Code S-PBGA-B2104 S-PBGA-B2577
Length 47.5 mm 52.5 mm
Number of CLBs 162000 162000
Number of Inputs 624 624
Number of Logic Cells 2835000 2835000
Number of Outputs 624 624
Number of Terminals 2104 2577
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min
Organization 162000 CLBS 162000 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA2104,46X46,40 BGA2577,51X51,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 4.32 mm 4.24 mm
Supply Voltage-Max 0.876 V 0.876 V
Supply Voltage-Min 0.825 V 0.825 V
Supply Voltage-Nom 0.85 V 0.85 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 47.5 mm 52.5 mm
Base Number Matches 2 2
ECCN Code 3A001.A.7.B
HTS Code 8542.39.00.01
Date Of Intro 2016-06-03

Compare XCVU11P-1FLGA2577E with alternatives