XCVU13P-2FHGA2104E vs XCVU13P-2FSGA2577I feature comparison

XCVU13P-2FHGA2104E AMD Xilinx

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XCVU13P-2FSGA2577I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code not_compliant compliant
ECCN Code 3A001.A.7.B 3A001.A.7.B
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2017-02-15 2018-11-12
JESD-30 Code S-PBGA-B2104 S-PBGA-B2577
JESD-609 Code e1
Length 52.5 mm 52.5 mm
Number of CLBs 216000 216000
Number of Inputs 832 832
Number of Logic Cells 3780000 3780000
Number of Outputs 832 832
Number of Terminals 2104 2577
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C
Organization 216000 CLBS 216000 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA2104,46X46,40 BGA2577,51X51,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 4.24 mm 4.51 mm
Supply Voltage-Max 0.876 V 0.876 V
Supply Voltage-Min 0.825 V 0.825 V
Supply Voltage-Nom 0.85 V 0.85 V
Surface Mount YES YES
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 52.5 mm 52.5 mm
Base Number Matches 1 1

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Compare XCVU13P-2FSGA2577I with alternatives