XCVU13P-L2FHGC2104E vs XCVU13P-L2FIGD2104E feature comparison

XCVU13P-L2FHGC2104E AMD Xilinx

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XCVU13P-L2FIGD2104E AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.B 3A001.A.7.B
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2016-06-03 2016-06-03
Additional Feature ALSO OPERATES AT 0.85V NOMINAL SUPPLY
JESD-30 Code S-PBGA-B2104 S-PBGA-B2104
Length 52.5 mm 52.5 mm
Number of CLBs 216000
Number of Inputs 416
Number of Logic Cells 3780000
Number of Outputs 416
Number of Terminals 2104 2104
Operating Temperature-Max 110 °C 100 °C
Operating Temperature-Min
Organization 216000 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA2104,46X46,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Packing Method BOX; TRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 4.32 mm 4.59 mm
Supply Voltage-Max 0.742 V 0.742 V
Supply Voltage-Min 0.698 V 0.698 V
Supply Voltage-Nom 0.72 V 0.72 V
Surface Mount YES YES
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 52.5 mm 52.5 mm
Base Number Matches 1 1
Package Description FBGA-2104
Temperature Grade OTHER

Compare XCVU13P-L2FHGC2104E with alternatives

Compare XCVU13P-L2FIGD2104E with alternatives