XIO2200AZGW
vs
OXPCIE958-FBAG
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
OXFORD SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA-176
|
,
|
| Pin Count |
176
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
| Address Bus Width |
|
|
| Bus Compatibility |
PCI
|
|
| Clock Frequency-Max |
100 MHz
|
|
| Drive Interface Standard |
IEEE1394; IEEE1394A
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PBGA-B176
|
|
| JESD-609 Code |
e1
|
|
| Length |
15 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
176
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Equivalence Code |
BGA176,17X17,32
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.4 mm
|
|
| Supply Voltage-Max |
1.65 V
|
|
| Supply Voltage-Min |
1.35 V
|
|
| Supply Voltage-Nom |
1.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
15 mm
|
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
|
| Base Number Matches |
1
|
1
|
|
|
|
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