XIO2200AZGW
vs
XIO3130ZHC
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA-176
|
GREEN, PLASTIC, BGA-196
|
Pin Count |
176
|
196
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
EAR99
|
HTS Code |
8542.31.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
Address Bus Width |
|
|
Bus Compatibility |
PCI
|
PCI
|
Clock Frequency-Max |
100 MHz
|
100 MHz
|
Drive Interface Standard |
IEEE1394; IEEE1394A
|
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PBGA-B176
|
S-PBGA-B196
|
JESD-609 Code |
e1
|
e1
|
Length |
15 mm
|
15 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
176
|
196
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LBGA
|
Package Equivalence Code |
BGA176,17X17,32
|
BGA196,14X14,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1.5 mm
|
Supply Voltage-Max |
1.65 V
|
1.65 V
|
Supply Voltage-Min |
1.35 V
|
1.35 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
15 mm
|
15 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
Base Number Matches |
1
|
1
|
|
|
|
Compare XIO2200AZGW with alternatives
Compare XIO3130ZHC with alternatives