XQKU5P-L1SFRB784I
vs
XCKU5P-1LFFVA676I
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
Reach Compliance Code |
not_compliant
|
compliant
|
JESD-30 Code |
S-PBGA-B784
|
|
JESD-609 Code |
e0
|
e1
|
Length |
23 mm
|
|
Moisture Sensitivity Level |
4
|
4
|
Number of CLBs |
27120
|
|
Number of Inputs |
304
|
|
Number of Logic Cells |
474600
|
|
Number of Outputs |
304
|
|
Number of Terminals |
784
|
|
Operating Temperature-Max |
100 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
27120 CLBS
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
FBGA
|
|
Package Equivalence Code |
BGA784,28X28,32
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, FINE PITCH
|
|
Peak Reflow Temperature (Cel) |
225
|
250
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Screening Level |
MIL-PRF-38535
|
|
Seated Height-Max |
3.52 mm
|
|
Supply Voltage-Max |
0.742 V
|
|
Supply Voltage-Min |
0.698 V
|
|
Supply Voltage-Nom |
0.72 V
|
|
Surface Mount |
YES
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
|
Terminal Pitch |
0.8 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
20
|
30
|
Width |
23 mm
|
|
Base Number Matches |
2
|
2
|
|
|
|