XR16L788IQ
vs
SCC2698BA1A84-T
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
EXAR CORP
|
PHILIPS COMPONENTS
|
| Part Package Code |
QFP
|
|
| Package Description |
14 X 20 MM, 3 MM HEIGHT, PLASTIC, QFP-100
|
,
|
| Pin Count |
100
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO OPERATES AT 2.97V MINIMUM SUPPLY
|
|
| Address Bus Width |
8
|
6
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
50 MHz
|
4 MHz
|
| Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP
|
| Data Encoding/Decoding Method |
NRZ
|
NRZ
|
| Data Transfer Rate-Max |
0.78125 MBps
|
0.0046875 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-PQFP-G100
|
S-PQCC-J84
|
| JESD-609 Code |
e0
|
|
| Length |
20 mm
|
|
| Low Power Mode |
YES
|
NO
|
| Number of Serial I/Os |
8
|
8
|
| Number of Terminals |
100
|
84
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
|
| Package Equivalence Code |
QFP100,.7X.9
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.4 mm
|
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XR16L788IQ with alternatives
Compare SCC2698BA1A84-T with alternatives