XR16L788IQ-F
vs
SCC2698BE1N64
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
EXAR CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFP
|
DIP
|
Package Description |
QFP, QFP100,.7X.9
|
DIP,
|
Pin Count |
100
|
64
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
EXAR
|
|
Address Bus Width |
8
|
6
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
50 MHz
|
4 MHz
|
Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT
|
Data Encoding/Decoding Method |
NRZ
|
NRZ
|
Data Transfer Rate-Max |
0.78125 MBps
|
0.125 MBps
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
R-PQFP-G100
|
R-PDIP-T64
|
JESD-609 Code |
e3
|
|
Length |
20 mm
|
81.665 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
1
|
|
Number of Serial I/Os |
8
|
8
|
Number of Terminals |
100
|
64
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
DIP
|
Package Equivalence Code |
QFP100,.7X.9
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.4 mm
|
5.84 mm
|
Supply Current-Max |
5 mA
|
30 mA
|
Supply Voltage-Max |
5.5 V
|
5.25 V
|
Supply Voltage-Min |
4.5 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
14 mm
|
22.86 mm
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
Base Number Matches |
2
|
2
|
Number of DMA Channels |
|
|
Number of I/O Lines |
|
|
On Chip Data RAM Width |
|
|
RAM (words) |
|
0
|
|
|
|
Compare SCC2698BE1N64 with alternatives