XWL1801MODGAMOCR
vs
BM83SM1-00AB
feature comparison
Part Life Cycle Code |
Obsolete
|
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
|
Package Description |
BGA,
|
|
Reach Compliance Code |
unknown
|
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
R-PBGA-B130
|
|
Length |
13.4 mm
|
|
Number of Functions |
1
|
|
Number of Terminals |
130
|
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
-20 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
GRID ARRAY
|
|
Seated Height-Max |
2 mm
|
|
Supply Voltage-Nom |
3.7 V
|
|
Surface Mount |
YES
|
|
Telecom IC Type |
TELECOM CIRCUIT
|
|
Temperature Grade |
OTHER
|
|
Terminal Form |
BALL
|
|
Terminal Position |
BOTTOM
|
|
Width |
13.3 mm
|
|
Base Number Matches |
1
|
|
|
|
|
Compare XWL1801MODGAMOCR with alternatives