XWL1801MODGAMOCR vs XWL1805MODGAMOCR feature comparison

XWL1801MODGAMOCR Texas Instruments

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XWL1805MODGAMOCR Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Package Description BGA, BGA,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PBGA-B130 R-PBGA-B130
Length 13.4 mm 13.4 mm
Number of Functions 1 1
Number of Terminals 130 130
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Seated Height-Max 2 mm 2 mm
Supply Voltage-Nom 3.7 V 3.7 V
Surface Mount YES YES
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Width 13.3 mm 13.3 mm
Base Number Matches 1 1

Compare XWL1801MODGAMOCR with alternatives

Compare XWL1805MODGAMOCR with alternatives