XWL1831MODGAMOCT vs WL1835MODGBMOC feature comparison

XWL1831MODGAMOCT Texas Instruments

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WL1835MODGBMOC Texas Instruments

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Pbfree Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Package Description LGA, BGA,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PBGA-N100 R-PBGA-B130
Length 13.4 mm 13.4 mm
Number of Functions 1 1
Number of Terminals 100 130
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Seated Height-Max 2 mm 2 mm
Surface Mount YES YES
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade OTHER OTHER
Terminal Form NO LEAD BALL
Terminal Pitch 0.7 mm
Terminal Position BOTTOM BOTTOM
Width 13.3 mm 13.3 mm
Base Number Matches 1 3
Supply Voltage-Nom 3.7 V

Compare XWL1831MODGAMOCT with alternatives

Compare WL1835MODGBMOC with alternatives