XWL1831MODGAMOCT vs WL1831MODGBMOCT feature comparison

XWL1831MODGAMOCT Texas Instruments

Buy Now Datasheet

WL1831MODGBMOCT Texas Instruments

Buy Now Datasheet
Pbfree Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Package Description LGA, MOC-100
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.31.00.01
JESD-30 Code R-PBGA-N100 R-PBGA-B100
Length 13.4 mm 13.4 mm
Number of Functions 1 1
Number of Terminals 100 100
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LGA LGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Seated Height-Max 2 mm 2 mm
Surface Mount YES YES
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade OTHER COMMERCIAL
Terminal Form NO LEAD BUTT
Terminal Pitch 0.7 mm 0.7 mm
Terminal Position BOTTOM BOTTOM
Width 13.3 mm 13.3 mm
Base Number Matches 1 1
Rohs Code No
ECCN Code 5A992.C
Samacsys Manufacturer Texas Instruments
Data Rate 100000 Mbps
JESD-609 Code e4
Moisture Sensitivity Level 3
Package Equivalence Code LGA100(UNSPEC)
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Supply Voltage-Nom 3.7 V
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare XWL1831MODGAMOCT with alternatives

Compare WL1831MODGBMOCT with alternatives