ZL30251LDG1
vs
ZL30251LDF1
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QCCN,
|
QFN-32
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| JESD-30 Code |
S-XQCC-N32
|
S-PQCC-N32
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
QUAD
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
CLOCK GENERATOR, PROCESSOR SPECIFIC
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
6 Weeks
|
| Length |
|
5 mm
|
| Output Clock Frequency-Max |
|
1035 MHz
|
| Package Equivalence Code |
|
LCC32,.2SQ,20
|
| Primary Clock/Crystal Frequency-Nom |
|
1250 MHz
|
| Seated Height-Max |
|
1 mm
|
| Supply Current-Max |
|
297 mA
|
| Supply Voltage-Max |
|
1.89 V
|
| Supply Voltage-Min |
|
1.71 V
|
| Supply Voltage-Nom |
|
1.8 V
|
| Terminal Pitch |
|
0.5 mm
|
| Width |
|
5 mm
|
|
|
|
Compare ZL30251LDG1 with alternatives
Compare ZL30251LDF1 with alternatives