ZL30261LDG1
vs
ZL30261LDF1
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HVQCCN, LCC56,.31SQ,20
|
HVQCCN, LCC56,.31SQ,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
6 Weeks
|
6 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Additional Feature |
ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY
|
ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY
|
| Family |
30261
|
30261
|
| Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
S-XQCC-N56
|
S-XQCC-N56
|
| Length |
8 mm
|
8 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
56
|
56
|
| Number of True Outputs |
12
|
12
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE WITH SERIES RESISTOR
|
3-STATE WITH SERIES RESISTOR
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC56,.31SQ,20
|
LCC56,.31SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TRAY
|
TR
|
| Power Supply Current-Max (ICC) |
682 mA
|
682 mA
|
| Propagation Delay (tpd) |
3.8 ns
|
3.8 ns
|
| Same Edge Skew-Max (tskwd) |
0.1 ns
|
0.1 ns
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
1.89 V
|
1.89 V
|
| Supply Voltage-Min (Vsup) |
1.71 V
|
1.71 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
8 mm
|
8 mm
|
| fmax-Min |
1045 MHz
|
1045 MHz
|
| Base Number Matches |
2
|
1
|
|
|
|