ZL30407QCC
vs
ZL30407/QCC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
ZARLINK SEMICONDUCTOR INC
|
| Part Package Code |
QFP
|
QFP
|
| Pin Count |
80
|
80
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-PQFP-G80
|
S-PQFP-G80
|
| Number of Terminals |
80
|
80
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
LQFP
|
| Package Equivalence Code |
QFP80,.64SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
0.155 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
SUPPORT CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
3
|
3
|
| Pbfree Code |
|
No
|
| Package Description |
|
LQFP,
|
| JESD-609 Code |
|
e0
|
| Length |
|
14 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of Functions |
|
1
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Seated Height-Max |
|
1.6 mm
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
14 mm
|
|
|
|
Compare ZL30407QCC with alternatives
Compare ZL30407/QCC with alternatives