ZL30795LFG7
vs
ZL88701LDG1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
HVQCCN, LCC64,.35SQ,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
IT ALSO REQUIRE 3.3V
|
SEATED HT-CALCULATED
|
| Applications |
SDH; SONET
|
|
| JESD-30 Code |
S-PBGA-N80
|
S-XQCC-N64
|
| JESD-609 Code |
e4
|
|
| Length |
11 mm
|
9 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
80
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
LGA
|
HVQCCN
|
| Package Equivalence Code |
LGA80(UNSPEC)
|
LCC64,.35SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Supply Voltage-Nom |
1.8 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
SLIC
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL GOLD
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
11 mm
|
9 mm
|
| Base Number Matches |
2
|
1
|
| Factory Lead Time |
|
36 Weeks
|
| Battery Feed |
|
CONSTANT CURRENT
|
| Hybrid |
|
2-4 CONVERSION
|
| Noise-Max |
|
19 dBrnC
|
| PSRR-Min |
|
40 dB
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
|
1 mm
|
| Terminal Pitch |
|
0.5 mm
|
|
|
|
Compare ZL30795LFG7 with alternatives
Compare ZL88701LDG1 with alternatives