ZL40200LDG1
vs
ZL40201LDF1
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
QFN-16
|
HVQCCN, LCC16,.12SQ,20
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
9 Weeks
|
|
Additional Feature |
ALSO OPERATES AT 3.3 V SUPPLY
|
ALSO OPERATES AT 3.3 V SUPPLY
|
Family |
4000/14000/40000
|
4000/14000/40000
|
Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
JESD-30 Code |
S-XQCC-N16
|
S-XQCC-N16
|
Length |
3 mm
|
3 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
16
|
16
|
Number of True Outputs |
4
|
4
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Packing Method |
TRAY
|
|
Propagation Delay (tpd) |
2 ns
|
2 ns
|
Same Edge Skew-Max (tskwd) |
0.1 ns
|
0.1 ns
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
QFN
|
Pin Count |
|
16
|
Package Equivalence Code |
|
LCC16,.12SQ,20
|
Prop. Delay@Nom-Sup |
|
2 ns
|
Qualification Status |
|
Not Qualified
|
|
|
|
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