ZL50018GAG2 vs ZL50015QCC feature comparison

ZL50018GAG2 Microsemi Corporation

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ZL50015QCC Microsemi Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code BGA QFP
Package Description 17 X 17 MM, 1.61 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, BGA-256 LFQFP, QFP256,1.2SQ,16
Pin Count 256 256
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B256 S-PQFP-G256
JESD-609 Code e1 e0
Length 17 mm 28 mm
Number of Functions 1 1
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFQFP
Package Equivalence Code BGA256,16X16,40 QFP256,1.2SQ,16
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 1.6 mm
Supply Current-Max 165 mA 150 mA
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Telecom IC Type DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.4 mm
Terminal Position BOTTOM QUAD
Width 17 mm 28 mm
Base Number Matches 1 2
Pbfree Code No

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