ZL50031QEG1 vs ZL50058GAG2 feature comparison

ZL50031QEG1 Zarlink Semiconductor Inc

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ZL50058GAG2 Microsemi Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC MICROSEMI CORP
Package Description 28 X 28 MM, 3.37 MM HEIGHT, LEAD FREE, MS-029, MQFP-256 17 X 17 MM, 1.61 MM HEIGH, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034, BGA-256
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G256 S-PBGA-B256
JESD-609 Code e3 e1
Length 28 mm 17 mm
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HFQFP BGA
Package Equivalence Code QFP256,1.2SQ,16
Package Shape SQUARE SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.7 mm 1.8 mm
Supply Voltage-Nom 3.3 V 1.8 V
Surface Mount YES YES
Telecom IC Type DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN SILVER COPPER
Terminal Form GULL WING BALL
Terminal Pitch 0.4 mm 1 mm
Terminal Position QUAD BOTTOM
Width 28 mm 17 mm
Base Number Matches 3 2
Part Package Code BGA
Pin Count 256

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