XC7K325T-2FFG676I
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
|
| Ihs Manufacturer |
XILINX INC
|
|
| Part Package Code |
BGA
|
|
| Pin Count |
676
|
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
3A991.D
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
65 Weeks
|
|
| Clock Frequency-Max |
1818 MHz
|
|
| Combinatorial Delay of a CLB-Max |
0.61 ns
|
|
| JESD-30 Code |
S-PBGA-B676
|
|
| JESD-609 Code |
e1
|
|
| Length |
27 mm
|
|
| Moisture Sensitivity Level |
4
|
|
| Number of CLBs |
25475
|
|
| Number of Inputs |
400
|
|
| Number of Logic Cells |
326080
|
|
| Number of Outputs |
400
|
|
| Number of Terminals |
676
|
|
| Operating Temperature-Max |
100 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
25475 CLBS
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
BGA
|
|
| Package Equivalence Code |
BGA676,26X26,40
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.37 mm
|
|
| Supply Voltage-Max |
1.03 V
|
|
| Supply Voltage-Min |
0.97 V
|
|
| Supply Voltage-Nom |
1 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
27 mm
|
|
| Base Number Matches |
1
|
|
|
|
|
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