There are no models available for this part yet.
Overview of 00543259 by Beck IPC GmbH
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Renewable Energy
Automotive
CAD Models for 00543259 by Beck IPC GmbH
Part Data Attributes for 00543259 by Beck IPC GmbH
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Rohs Code
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Yes
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Part Life Cycle Code
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Contact Manufacturer
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Ihs Manufacturer
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BECK IPC GMBH
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Package Description
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BGA,
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Reach Compliance Code
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unknown
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HTS Code
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8542.31.00.01
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JESD-30 Code
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S-PBGA-B177
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Length
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25 mm
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Moisture Sensitivity Level
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3
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Number of Terminals
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177
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-25 °C
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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BGA
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Seated Height-Max
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5 mm
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Supply Voltage-Max
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3.465 V
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Supply Voltage-Min
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3.135 V
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Supply Voltage-Nom
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3.3 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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OTHER
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Terminal Form
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BALL
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Terminal Pitch
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1.27 mm
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Terminal Position
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BOTTOM
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Width
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25 mm
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uPs/uCs/Peripheral ICs Type
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MICROPROCESSOR CIRCUIT
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