Part Details for 00543260 by Beck IPC GmbH
Overview of 00543260 by Beck IPC GmbH
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Part Details for 00543260
00543260 CAD Models
00543260 Part Data Attributes:
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00543260
Beck IPC GmbH
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00543260
Beck IPC GmbH
Microprocessor Circuit, CMOS, PBGA177, ROHS COMPLIANT, PLASTIC, BGA-177
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Rohs Code | Yes | |
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | BECK IPC GMBH | |
Package Description | BGA, | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
JESD-30 Code | S-PBGA-B177 | |
Length | 25 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 177 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -25 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Seated Height-Max | 5 mm | |
Supply Voltage-Max | 3.465 V | |
Supply Voltage-Min | 3.135 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |