Datasheets
10AX027H4F34E3SG by:

Field Programmable Gate Array, 270000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FBGA-1152

Part Details for 10AX027H4F34E3SG by Intel Corporation

Overview of 10AX027H4F34E3SG by Intel Corporation

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Price & Stock for 10AX027H4F34E3SG

Part # Distributor Description Stock Price Buy
DISTI # 544-3560-ND
DigiKey IC FPGA 384 I/O 1152FBGA Min Qty: 3 Lead time: 16 Weeks Container: Tray Temporarily Out of Stock
  • 3 $1,124.6433
$1,124.6433 Buy Now
Chip1Cloud   34175
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Part Details for 10AX027H4F34E3SG

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10AX027H4F34E3SG Part Data Attributes:

10AX027H4F34E3SG Intel Corporation
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10AX027H4F34E3SG Intel Corporation Field Programmable Gate Array, 270000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FBGA-1152
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
ECCN Code 3A991
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel
JESD-30 Code S-PBGA-B1152
Length 35 mm
Number of CLBs 10162
Number of Inputs 384
Number of Logic Cells 270000
Number of Outputs 384
Number of Terminals 1152
Operating Temperature-Max 100 °C
Operating Temperature-Min
Organization 10162 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.35 mm
Supply Voltage-Max 0.93 V
Supply Voltage-Min 0.87 V
Supply Voltage-Nom 0.9 V
Surface Mount YES
Technology TSMC
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 35 mm

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