Part Details for 10AX048E4F29E3SG by Intel Corporation
Overview of 10AX048E4F29E3SG by Intel Corporation
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Price & Stock for 10AX048E4F29E3SG
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
544-3549-ND
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DigiKey | IC FPGA 360 I/O 780FBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$1,713.3700 | Buy Now |
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Chip1Cloud | IC FPGA 360 I/O 780FBGA | 30 |
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RFQ |
Part Details for 10AX048E4F29E3SG
10AX048E4F29E3SG CAD Models
10AX048E4F29E3SG Part Data Attributes
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10AX048E4F29E3SG
Intel Corporation
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Datasheet
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10AX048E4F29E3SG
Intel Corporation
Field Programmable Gate Array, 480000-Cell, CMOS, PBGA780, 29 X 29 MM, ROHS COMPLIANT, FBGA-780
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B780 | |
| Length | 29 mm | |
| Number of CLBs | 18359 | |
| Number of Inputs | 360 | |
| Number of Logic Cells | 480000 | |
| Number of Outputs | 360 | |
| Number of Terminals | 780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Organization | 18359 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.35 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | TSMC | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 29 mm |