Datasheets
10AX115N4F45E3SG by:

Field Programmable Gate Array, 1150000-Cell, CMOS, PBGA1932, 45 X 45 MM, ROHS COMPLIANT, FBGA-1932

Part Details for 10AX115N4F45E3SG by Intel Corporation

Results Overview of 10AX115N4F45E3SG by Intel Corporation

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10AX115N4F45E3SG Information

10AX115N4F45E3SG by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Part Details for 10AX115N4F45E3SG

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10AX115N4F45E3SG Part Data Attributes

10AX115N4F45E3SG Intel Corporation
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10AX115N4F45E3SG Intel Corporation Field Programmable Gate Array, 1150000-Cell, CMOS, PBGA1932, 45 X 45 MM, ROHS COMPLIANT, FBGA-1932
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEL CORP
Package Description FBGA-1932
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel
JESD-30 Code S-PBGA-B1932
Length 45 mm
Number of CLBs 42720
Number of Inputs 768
Number of Logic Cells 1150000
Number of Outputs 768
Number of Terminals 1932
Operating Temperature-Max 100 °C
Operating Temperature-Min
Organization 42720 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1932,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.5 mm
Supply Voltage-Max 0.93 V
Supply Voltage-Min 0.87 V
Supply Voltage-Nom 0.9 V
Surface Mount YES
Technology TSMC
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 45 mm

10AX115N4F45E3SG Related Parts

10AX115N4F45E3SG Frequently Asked Questions (FAQ)

  • The maximum power consumption of the 10AX115N4F45E3SG FPGA is approximately 12W, but this can vary depending on the specific design and usage.

  • Intel recommends using a clocking scheme that includes a clock manager, such as the Intel FPGA Clock Manager, to ensure reliable clock distribution and minimize clock skew.

  • To optimize power consumption, use Intel's Power Analyzer tool to identify areas of high power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.

  • To ensure signal integrity, use Intel's Signal Integrity Tool to analyze and optimize signal routing, and follow best practices for signal routing, such as using differential signaling and minimizing signal length.

  • The maximum operating temperature of the 10AX115N4F45E3SG FPGA is 100°C, but it is recommended to operate the device at a temperature below 85°C for optimal performance and reliability.

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