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Field Programmable Gate Array, 2000-Cell, CMOS, PBGA169, 11 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, UBGA-169
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10M02SCU169I7G by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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Win Source Electronics | IC FPGA 130 I/O 169UBGA | 8900 |
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$9.9584 / $14.9376 | Buy Now |
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10M02SCU169I7G
Intel Corporation
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Datasheet
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10M02SCU169I7G
Intel Corporation
Field Programmable Gate Array, 2000-Cell, CMOS, PBGA169, 11 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, UBGA-169
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 11 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, UBGA-169 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
Additional Feature | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | |
JESD-30 Code | S-PBGA-B169 | |
JESD-609 Code | e1 | |
Length | 11 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 125 | |
Number of Inputs | 246 | |
Number of Logic Cells | 2000 | |
Number of Outputs | 246 | |
Number of Terminals | 169 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 125 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA169,13X13,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.55 mm | |
Supply Voltage-Max | 3.15 V | |
Supply Voltage-Min | 2.85 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 11 mm |