Datasheets
4814P-2-332 by: Bourns Inc

Array/Network Resistor, Bussed, Metal Glaze/thick Film, 1.12W, 3300ohm, 50V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 2239, DSOP

Part Details for 4814P-2-332 by Bourns Inc

Results Overview of 4814P-2-332 by Bourns Inc

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4814P-2-332 Information

4814P-2-332 by Bourns Inc is an Array/Network Resistor.
Array/Network Resistors are under the broader part category of Resistors.

Resistors are passive components that work by limiting electron flow in a circuit. They are available as fixed or as variable (potentionmeters). Read more about Resistors on our Resistors part category page.

Price & Stock for 4814P-2-332

Part # Distributor Description Stock Price Buy
DISTI # 04B8703
Newark Resistors Network-Thick Film Smd Med Body |Bourns 4814P-2-332 RoHS: Not Compliant Min Qty: 2000 Package Multiple: 1 Date Code: 0 Container: Reel 0
  • 2,000 $0.7830
  • 4,000 $0.7110
  • 6,000 $0.6890
  • 10,000 $0.6750
$0.6750 / $0.7830 Buy Now
DISTI # 4814P-2-332
Avnet Americas - Tape and Reel (Alt: 4814P-2-332) COO: Costa Rica RoHS: Not Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 7 Weeks, 0 Days Container: Reel 0
  • 2,000 $0.6250
  • 4,000 $0.6075
  • 8,000 $0.5917
  • 12,000 $0.5760
  • 16,000 $0.5625
$0.5625 / $0.6250 Buy Now
DISTI # 73590980
RS RNET-THK FILM SMD MED BODY Min Qty: 2000 Package Multiple: 1 Lead time: 10 Weeks, 0 Days Container: Bulk 0
  • 2,000 $0.6800
  • 10,000 $0.6400
  • 20,000 $0.6100
$0.6100 / $0.6800 RFQ

US Tariff Estimator: 4814P-2-332 by Bourns Inc

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4814P-2-332
Bourns Inc
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Part Details for 4814P-2-332

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4814P-2-332 Part Data Attributes

4814P-2-332 Bourns Inc
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4814P-2-332 Bourns Inc Array/Network Resistor, Bussed, Metal Glaze/thick Film, 1.12W, 3300ohm, 50V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 2239, DSOP
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer BOURNS INC
Package Description DIP
Reach Compliance Code Not Compliant
ECCN Code EAR99
HTS Code 8533.21.00.20
Factory Lead Time 7 Weeks
Samacsys Manufacturer Bourns
Construction Rectangular
Element Power Dissipation 0.08 W
First Element Resistance 3300 Ω
JESD-609 Code e0
Mounting Feature SURFACE MOUNT
Network Type BUSSED
Number of Elements 13
Number of Functions 1
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Height 2.03 mm
Package Length 9.91 mm
Package Shape RECTANGULAR PACKAGE
Package Style DIP
Package Width 5.59 mm
Packing Method TR, 13 INCH
Rated Power Dissipation (P) 1.12 W
Rated Temperature 70 °C
Reference Standard AEC-Q200
Resistance 3300 Ω
Resistor Type ARRAY/NETWORK RESISTOR
Second/Last Element Resistance 3300 Ω
Surface Mount YES
Technology METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C
Temperature Coefficient Tracking 50 ppm/°C
Terminal Finish TIN LEAD
Terminal Shape GULL WING
Tolerance 2%
Working Voltage 50 V
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4814P-2-332 Related Parts

4814P-2-332 Frequently Asked Questions (FAQ)

  • Bourns provides a recommended PCB layout and land pattern in their application note AN164, which can be found on their website. It's essential to follow these guidelines to ensure proper mounting and to minimize thermal resistance.

  • The 4814P-2-332 has a high power rating, and proper thermal management is crucial. Ensure good airflow, use a heat sink if necessary, and follow the recommended PCB layout to minimize thermal resistance. You can also consider using thermal interface materials to improve heat transfer.

  • While the datasheet specifies an operating temperature range of -40°C to 125°C, it's essential to note that the device's performance and reliability may degrade at extreme temperatures. It's recommended to operate the device within a temperature range of -20°C to 100°C for optimal performance.

  • The 4814P-2-332 is designed to withstand moderate vibration levels. However, if your application involves extreme vibration, it's recommended to take additional measures such as using a vibration-dampening material or a more secure mounting method to ensure the device's reliability.

  • While the 4814P-2-332 meets various safety and regulatory standards, it's essential to review the specific requirements of your application and ensure the device meets those standards. You may need to perform additional testing or certification to meet your application's requirements.

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