Part Details for 5CSEBA4U23I7N by Intel Corporation
Overview of 5CSEBA4U23I7N by Intel Corporation
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for 5CSEBA4U23I7N
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
544-3011-ND
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DigiKey | IC SOC CORTEX-A9 800MHZ 672UBGA Min Qty: 60 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$180.9302 | Buy Now |
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MacroQuest Electronics | ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018 | 485 |
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$82.5000 / $110.0000 | Buy Now |
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Win Source Electronics | IC SOC CORTEX-A9 800MHZ 672UBGA / Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SE FPGA - 40K Logic Elements 800MHz 672-UBGA (23x23) | 15000 |
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$97.9710 / $116.8120 | Buy Now |
Part Details for 5CSEBA4U23I7N
5CSEBA4U23I7N CAD Models
5CSEBA4U23I7N Part Data Attributes:
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5CSEBA4U23I7N
Intel Corporation
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Datasheet
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5CSEBA4U23I7N
Intel Corporation
Field Programmable Gate Array, 40000-Cell, CMOS, PBGA672, ROHS COMPLIANT, UBGA-672
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | ROHS COMPLIANT, UBGA-672 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
JESD-30 Code | S-PBGA-B672 | |
JESD-609 Code | e1 | |
Length | 23 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 672 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Seated Height-Max | 1.85 mm | |
Supply Voltage-Max | 1.13 V | |
Supply Voltage-Min | 1.07 V | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 23 mm |