-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
70T3519S166BCGI by Renesas Electronics Corporation is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
70T3519S166BCGI | Renesas Electronics Corporation | 256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's |
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
70T3519S166BCGI
|
Avnet Americas | 256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's - Trays (Alt: 70T3519S166BCGI) RoHS: Compliant Min Qty: 18 Package Multiple: 6 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
|
$232.6444 | Buy Now |
DISTI #
70T3519S166BCGI
|
Avnet Silica | 256K x 36 Sync 33V25V DualPort RAM Interleaved IOs (Alt: 70T3519S166BCGI) RoHS: Compliant Min Qty: 6 Package Multiple: 6 Lead time: 19 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
|
Flip Electronics | Stock | 150 |
|
RFQ |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
70T3519S166BCGI
Renesas Electronics Corporation
Buy Now
Datasheet
|
Compare Parts:
70T3519S166BCGI
Renesas Electronics Corporation
256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | CABGA | |
Pin Count | 256 | |
Manufacturer Package Code | BCG256 | |
Reach Compliance Code | compliant | |
ECCN Code | NLR | |
HTS Code | 8542320041 | |
Factory Lead Time | 18 Weeks | |
Samacsys Manufacturer | Renesas Electronics | |
Access Time-Max | 12 ns | |
Additional Feature | PIPELINED OR FLOW-THROUGH ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 166 MHz | |
I/O Type | COMMON | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Memory Density | 9437184 bit | |
Memory IC Type | MULTI-PORT SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 2 | |
Number of Terminals | 256 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256KX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.7 mm | |
Standby Current-Max | 0.02 A | |
Standby Voltage-Min | 2.4 V | |
Supply Current-Max | 0.51 mA | |
Supply Voltage-Max (Vsup) | 2.6 V | |
Supply Voltage-Min (Vsup) | 2.4 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm |
This table gives cross-reference parts and alternative options found for 70T3519S166BCGI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70T3519S166BCGI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
70T3519S133BCI8 | Renesas Electronics Corporation | Check for Price | 256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | 70T3519S166BCGI vs 70T3519S133BCI8 |
70T3519S133BCGI8 | Integrated Device Technology Inc | Check for Price | Multi-Port SRAM, 256KX36, 15ns, CMOS, PBGA256 | 70T3519S166BCGI vs 70T3519S133BCGI8 |
70T3519S133BCI | Renesas Electronics Corporation | Check for Price | 256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | 70T3519S166BCGI vs 70T3519S133BCI |
70T3519S166BCGI8 | Integrated Device Technology Inc | Check for Price | Multi-Port SRAM, 256KX36, 12ns, CMOS, PBGA256 | 70T3519S166BCGI vs 70T3519S166BCGI8 |
70T3519S133BC | Renesas Electronics Corporation | Check for Price | 256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | 70T3519S166BCGI vs 70T3519S133BC |
IDT70T3519S133BCG | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM, 256KX36, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | 70T3519S166BCGI vs IDT70T3519S133BCG |
IDT70T3519S133BC | Renesas Electronics Corporation | Check for Price | Multi-Port SRAM, 256KX36, 15ns, CMOS, PBGA256 | 70T3519S166BCGI vs IDT70T3519S133BC |
70T3519S166BCI8 | Integrated Device Technology Inc | Check for Price | CABGA-256, Reel | 70T3519S166BCGI vs 70T3519S166BCI8 |
IDT70T3519S166BCG | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM, 256KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | 70T3519S166BCGI vs IDT70T3519S166BCG |
70T3519S166BCG | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM, 256KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | 70T3519S166BCGI vs 70T3519S166BCG |