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Purchasing Insights: 74AUP1G125DCKRG4

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Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

For Purchasing Risk Rank, we focus on the Production and the Long Term Phases on FindChips in our evaluation of Risk.

Production Phase

The production phase is when the product is being assembled. Sourcing parts reliably is the essential task during this phase, as it determines whether the product can continue production. During the production phase, there is no time to test new components if something goes awry – the design is the locked-in and a primary risk factor is the component availability in the marketplace. It is possible to utilize alternative parts if things go wrong during this phase, but they need to be FFF (form, fit, function) compatible. Therefore, if a part is available in the online marketplace and has available FFF components, it will be listed as lower risk.

Long Term Phase

The amount of time that a product is manufactured often depends on the industry. Some automobile electronics are made consistently for 5-10 years, whereas military and industrial electronics could be produced from anywhere from 30-50 years.

This means part risk goes up with the likelihood of obsolescence. If a chip manufacturer decides to stop making a particular chip, it is supremely disruptive to mature products, because there may not even be replacement parts available. Other factors like environmental certifications (RoHS) feed into this as well, as non-certified parts are more likely to become obsolete in the future.

We combine both of these aspects into a Purchasing Risk Rank score in order to focus in on risk elements that would be most pertinent for purchasers to be aware of.

Risk Rank Breakdown

Risk Rank: Purchasing Risk

What is purchasing risk rank?

Purchasing Risk Rank is determined by in-depth analysis across risk factors of production risk and long term risk of a given part.

Learn more

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Part Details for: 74AUP1G125DCKRG4

Part Details

Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk rank using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price, inventory votality, current inventory availability, and much more. Even the availability of manufacturer specifications and part documentation, such as datasheets and reference designs, have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on FindChips in our evaluation of Risk.

Design Phase

The design phase of a product is the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

Risk Rank: Design Risk

What is design risk rank?

Design Risk Rank is determined by in-depth analysis across risk factors, including part availability, functional equivalents, lifecycle, and more.

Learn more

Alternate Parts for: 74AUP1G125DCKRG4

Part Number Description Manufacturer Compare
74AUP1G125GW Logic Bus Driver, 1-Func, 1-Bit, True Output, CMOS, PDSO5, Philips Semiconductors 74AUP1G125DCKRG4 vs 74AUP1G125GW
74AUP1G125GW-Q100H Logic Low-power buffer/line driver; 3-state TSSOP 5-Pin NXP Semiconductors 74AUP1G125DCKRG4 vs 74AUP1G125GW-Q100H
Part Number Description Manufacturer Compare
74AUP1G125GM,115 Logic 74AUP1G125 - Low-power buffer/line driver; 3-state SON 6-Pin NXP Semiconductors 74AUP1G125DCKRG4 vs 74AUP1G125GM,115
74AUP1G126GM,115 Logic 74AUP1G126 - Low-power buffer/line-driver; 3-state SON 6-Pin NXP Semiconductors 74AUP1G125DCKRG4 vs 74AUP1G126GM,115
SN74AUP1G125YZPR Logic Single 0.8-V to 3.6-V low power buffer with 3-state outputs 5-DSBGA -40 to 85 Texas Instruments 74AUP1G125DCKRG4 vs SN74AUP1G125YZPR
SN74AUP1G126DSFR Logic Single 0.8-V to 3.6-V low power buffer with 3-state outputs 6-SON -40 to 85 Texas Instruments 74AUP1G125DCKRG4 vs SN74AUP1G126DSFR
SN74AUP1G126DRLR Logic Single 0.8-V to 3.6-V low power buffer with 3-state outputs 5-SOT-5X3 -40 to 85 Texas Instruments 74AUP1G125DCKRG4 vs SN74AUP1G126DRLR
74AUP1G125DRLRG4 Logic Low-Power Single Bus Buffer Gate with 3-State Output 5-SOT-5X3 -40 to 85 Texas Instruments 74AUP1G125DCKRG4 vs 74AUP1G125DRLRG4
74AUP1G125GW-Q100H Logic Low-power buffer/line driver; 3-state TSSOP 5-Pin NXP Semiconductors 74AUP1G125DCKRG4 vs 74AUP1G125GW-Q100H
74AUP1G125GW Logic Bus Driver, 1-Func, 1-Bit, True Output, CMOS, PDSO5, Philips Semiconductors 74AUP1G125DCKRG4 vs 74AUP1G125GW
SN74AUP1G125DBVR Logic Single 0.8-V to 3.6-V low power buffer with 3-state outputs 5-SOT-23 -40 to 85 Texas Instruments 74AUP1G125DCKRG4 vs SN74AUP1G125DBVR
74AUP1G125GF Logic Bus Driver, 1-Func, 1-Bit, True Output, CMOS, PDSO6 Philips Semiconductors 74AUP1G125DCKRG4 vs 74AUP1G125GF

Resources and Additional Insights

Reference Designs

  • TIDA-00403 Ultrasonic Distance Measurement using the TLV320AIC3268 miniDSP CODEC Reference Design | TI.com
    TIDA-00403: The TIDA-00403 reference design uses off-the-shelf EVMs for ultrasonic distance measurement solutions using algorithms within the TLV320AIC3268 miniDSP. In conjunction with TI’s PurePath Studio design suite, a robust and user configurable ultrasonic distance measurement system can be designed with the click of a mouse. The ultrasonic burst generation characteristics as well as detection algorithms can be user modified to fit specific use cases in industrial and measurement applications allowing users to overcome the limitations of other fixed function sensors while simultaneously increasing reliability of the measurements. Two GPIOs on the TLV320AIC3268 are automatically triggered indicating a transmitted and received ultrasonic burst. With a host MCU monitoring these GPIOs, the time of flight can be extracted.
  • TIDA-00385 High Fidelity Audio Headphone Playback Reference Design for Portable and Smartphone Applications | TI.com
    TIDA-00385: Since the use of high fidelity headphones is a growing trend for portable audio playback, higher performance DAC and Headphone Amplifiers are demanded. This system converts digital audio from USB, SPDIF, or optical sources into analog using PCM5242 audio DAC. A high performance TPA6120A2 headphone amplifier in conjunction with the differential DAC achieves stunning musical clarity and definition as well as industry leading noise performance, critical for low noise headphone playback. The power supply architecture is designed to work from a 3.3V source to increase flexibility and integration into existing products and systems.
  • Ultrasonic Distance Measurement using the TLV320AIC3268 miniDSP CODEC Reference Design
    TIDA-00403: The TIDA-00403 reference design uses off-the-shelf EVMs for ultrasonic distance measurement solutions using algorithms within the TLV320AIC3268 miniDSP. In conjunction with TI’s PurePath Studio design suite, a robust and user configurable ultrasonic distance measurement system can be designed with the click of a mouse. The ultrasonic burst generation characteristics as well as detection algorithms can be user modified to fit specific use cases in industrial and measurement applications allowing users to overcome the limitations of other fixed function sensors while simultaneously increasing reliability of the measurements. Two GPIOs on the TLV320AIC3268 are automatically triggered indicating a transmitted and received ultrasonic burst. With a host MCU monitoring these GPIOs, the time of flight can be extracted.
  • High Fidelity Audio Headphone Playback Reference Design for Portable and Smartphone Applications
    TIDA-00385: Since the use of high fidelity headphones is a growing trend for portable audio playback, higher performance DAC and Headphone Amplifiers are demanded. This system converts digital audio from USB, SPDIF, or optical sources into analog using PCM5242 audio DAC. A high performance TPA6120A2 headphone amplifier in conjunction with the differential DAC achieves stunning musical clarity and definition as well as industry leading noise performance, critical for low noise headphone playback. The power supply architecture is designed to work from a 3.3V source to increase flexibility and integration into existing products and systems.

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