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Overview of 74AUP1G125GW-Q100H by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Automotive
CAD Models for 74AUP1G125GW-Q100H by NXP Semiconductors
Part Data Attributes for 74AUP1G125GW-Q100H by NXP Semiconductors
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
Part Package Code
|
TSSOP
|
Package Description
|
1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5
|
Pin Count
|
5
|
Manufacturer Package Code
|
SOT353-1
|
Reach Compliance Code
|
compliant
|
Control Type
|
ENABLE LOW
|
Family
|
AUP/ULP/V
|
JESD-30 Code
|
R-PDSO-G5
|
Length
|
2.05 mm
|
Load Capacitance (CL)
|
30 pF
|
Logic IC Type
|
BUS DRIVER
|
Max I(ol)
|
0.0017 A
|
Number of Bits
|
1
|
Number of Functions
|
1
|
Number of Ports
|
2
|
Number of Terminals
|
5
|
Operating Temperature-Max
|
125 °C
|
Operating Temperature-Min
|
-40 °C
|
Output Characteristics
|
3-STATE
|
Output Polarity
|
TRUE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TSSOP
|
Package Equivalence Code
|
TSSOP5/6,.08
|
Package Shape
|
RECTANGULAR
|
Package Style
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method
|
TR
|
Prop. Delay@Nom-Sup
|
19 ns
|
Propagation Delay (tpd)
|
24 ns
|
Qualification Status
|
Not Qualified
|
Screening Level
|
AEC-Q100
|
Seated Height-Max
|
1.1 mm
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
0.8 V
|
Supply Voltage-Nom (Vsup)
|
1.1 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
AUTOMOTIVE
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.65 mm
|
Terminal Position
|
DUAL
|
Width
|
1.25 mm
|
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