Part Details for 74LVC1G57GW-Q100 by Nexperia
Overview of 74LVC1G57GW-Q100 by Nexperia
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Financial Technology (Fintech)
Healthcare
Part Details for 74LVC1G57GW-Q100
74LVC1G57GW-Q100 CAD Models
74LVC1G57GW-Q100 Part Data Attributes
|
74LVC1G57GW-Q100
Nexperia
Buy Now
Datasheet
|
Compare Parts:
74LVC1G57GW-Q100
Nexperia
Logic Circuit, CMOS, PDSO6
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NEXPERIA | |
Package Description | SC-88, 6 PIN | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Family | LVC/LCX/Z | |
JESD-30 Code | R-PDSO-G6 | |
JESD-609 Code | e3 | |
Length | 2 mm | |
Logic IC Type | LOGIC CIRCUIT | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 6 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.1 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 1.65 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 1.25 mm |