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Part Details for 74LVC30APWJ by Nexperia
Overview of 74LVC30APWJ by Nexperia
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Telecommunications
Price & Stock for 74LVC30APWJ
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
74LVC30APWJ
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Avnet Americas | NAND Gate 1-Element 8-IN CMOS 14-Pin TSSOP T/R - Tape and Reel (Alt: 74LVC30APWJ) RoHS: Compliant Min Qty: 3383 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Reel | 75963 Partner Stock |
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$0.0931 / $0.1109 | Buy Now |
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Rochester Electronics | 74LVC30A - 8-input NAND gate RoHS: Compliant Status: Obsolete Min Qty: 1 | 75963 |
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$0.0916 / $0.1078 | Buy Now |
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DISTI #
74LVC30APWJ
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Avnet Silica | NAND Gate 1-Element 8-IN CMOS 14-Pin TSSOP T/R (Alt: 74LVC30APWJ) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 54 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for 74LVC30APWJ
74LVC30APWJ CAD Models
74LVC30APWJ Part Data Attributes
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74LVC30APWJ
Nexperia
Buy Now
Datasheet
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Compare Parts:
74LVC30APWJ
Nexperia
74LVC30A - 8-input NAND gate@en-us TSSOP 14-Pin
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NEXPERIA | |
| Part Package Code | TSSOP | |
| Package Description | 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 | |
| Pin Count | 14 | |
| Manufacturer Package Code | SOT402-1 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | Nexperia | |
| Family | LVC/LCX/Z | |
| JESD-30 Code | R-PDSO-G14 | |
| Length | 5 mm | |
| Logic IC Type | NAND GATE | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Inputs | 8 | |
| Number of Terminals | 14 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Propagation Delay (tpd) | 12.3 ns | |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 1.65 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4.4 mm |