Part Details for 74AHCT1G125GM,115 by NXP Semiconductors
Overview of 74AHCT1G125GM,115 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for 74AHCT1G125GM,115
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-74AHCT1G125GM,115-ND
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DigiKey | IC BUFFER NON-INVERT 5.5V 6XSON Min Qty: 4594 Container: Bulk MARKETPLACE PRODUCT |
9800 In Stock |
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$0.0700 | Buy Now |
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Rochester Electronics | 74AHCT1G125GM - Bus Driver, AHCT/VHCT/VT Series, 1-Func, 1-Bit, True Output, CMOS, XSON6 RoHS: Compliant Status: Active Min Qty: 1 | 2000 |
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$0.0560 / $0.0659 | Buy Now |
Part Details for 74AHCT1G125GM,115
74AHCT1G125GM,115 CAD Models
74AHCT1G125GM,115 Part Data Attributes
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74AHCT1G125GM,115
NXP Semiconductors
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Datasheet
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74AHCT1G125GM,115
NXP Semiconductors
74AHC(T)1G125 - Bus buffer/line driver; 3-state SON 6-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SON | |
Package Description | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 | |
Pin Count | 6 | |
Manufacturer Package Code | SOT886 | |
Reach Compliance Code | compliant | |
Control Type | ENABLE LOW | |
Family | AHCT/VHCT/VT | |
JESD-30 Code | R-PDSO-N6 | |
JESD-609 Code | e3 | |
Length | 1.45 mm | |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | BUS DRIVER | |
Max I(ol) | 0.008 A | |
Moisture Sensitivity Level | 1 | |
Number of Bits | 1 | |
Number of Functions | 1 | |
Number of Ports | 2 | |
Number of Terminals | 6 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VSON | |
Package Equivalence Code | SOLCC6,.04,20 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, VERY THIN PROFILE | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Prop. Delay@Nom-Sup | 9.5 ns | |
Propagation Delay (tpd) | 9.5 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.5 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 1 mm |