Part Details for 74ALVCH16260PAG by Integrated Device Technology Inc
Overview of 74ALVCH16260PAG by Integrated Device Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Computing and Data Storage
Price & Stock for 74ALVCH16260PAG
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | 74ALVCH16260 - 3.3V CMOS 12-Bit To 24-Bit Multiplexed D-Type Latch With 3-State Outputs And Bus-Hold ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 11563 |
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$0.2514 / $0.2958 | Buy Now |
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Chip1Cloud | IC LATCH 12-24BIT 3.3V 56-TSSOP | 17000 |
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RFQ |
Part Details for 74ALVCH16260PAG
74ALVCH16260PAG CAD Models
74ALVCH16260PAG Part Data Attributes:
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74ALVCH16260PAG
Integrated Device Technology Inc
Buy Now
Datasheet
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Compare Parts:
74ALVCH16260PAG
Integrated Device Technology Inc
TSSOP-56, Tube
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | TSSOP | |
| Package Description | TSSOP-56 | |
| Pin Count | 56 | |
| Manufacturer Package Code | PAG56 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Control Type | ENABLE LOW | |
| Count Direction | BIDIRECTIONAL | |
| Family | ALVC/VCX/A | |
| JESD-30 Code | R-PDSO-G56 | |
| JESD-609 Code | e3 | |
| Length | 14 mm | |
| Load Capacitance (CL) | 50 pF | |
| Logic IC Type | BUS EXCHANGER | |
| Max I(ol) | 0.024 A | |
| Moisture Sensitivity Level | 1 | |
| Number of Bits | 12 | |
| Number of Functions | 1 | |
| Number of Inputs | 1 | |
| Number of Outputs | 2 | |
| Number of Ports | 3 | |
| Number of Terminals | 56 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Characteristics | 3-STATE | |
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP56,.3,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Prop. Delay@Nom-Sup | 4.4 ns | |
| Propagation Delay (tpd) | 5.6 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 6.1 mm |