Part Details for 74AUP1G07GN,132 by NXP Semiconductors
Overview of 74AUP1G07GN,132 by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Financial Technology (Fintech)
Healthcare
Price & Stock for 74AUP1G07GN,132
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-74AUP1G07GN,132-ND
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DigiKey | NOW NEXPERIA 74AUP1G07GN - BUFFE Min Qty: 2885 Container: Bulk MARKETPLACE PRODUCT |
384959 In Stock |
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$0.1000 | Buy Now |
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Bristol Electronics | 1325 |
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RFQ | ||
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Rochester Electronics | 74AUP1G07GN - Buffer, AUP/ULP/V Series, 1-Func, 1-Input, CMOS, X2SON6 RoHS: Compliant Status: Active Min Qty: 1 | 384959 |
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$0.0892 / $0.1050 | Buy Now |
Part Details for 74AUP1G07GN,132
74AUP1G07GN,132 CAD Models
74AUP1G07GN,132 Part Data Attributes
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74AUP1G07GN,132
NXP Semiconductors
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Datasheet
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74AUP1G07GN,132
NXP Semiconductors
74AUP1G07 - Low-power buffer with open-drain output SON 6-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SON | |
Package Description | 0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, SON-6 | |
Pin Count | 6 | |
Manufacturer Package Code | SOT1115 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 4 Weeks | |
Family | AUP/ULP/V | |
JESD-30 Code | R-PDSO-N6 | |
JESD-609 Code | e3 | |
Length | 1 mm | |
Load Capacitance (CL) | 30 pF | |
Logic IC Type | BUFFER | |
Max I(ol) | 0.0017 A | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Inputs | 1 | |
Number of Terminals | 6 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | OPEN-DRAIN | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SON | |
Package Equivalence Code | SOLCC6,.04,12 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Prop. Delay@Nom-Sup | 20.7 ns | |
Propagation Delay (tpd) | 20.7 ns | |
Qualification Status | Not Qualified | |
Schmitt Trigger | NO | |
Seated Height-Max | 0.35 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 0.8 V | |
Supply Voltage-Nom (Vsup) | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.3 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 0.9 mm |