Part Details for 74AUP1G126GN,132 by NXP Semiconductors
Overview of 74AUP1G126GN,132 by NXP Semiconductors
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Applications
Energy and Power Systems
Renewable Energy
Automotive
Price & Stock for 74AUP1G126GN,132
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-74AUP1G126GN,132-ND
|
DigiKey | IC BUFFER NON-INVERT 3.6V 6XSON Min Qty: 1920 Container: Bulk MARKETPLACE PRODUCT |
150000 In Stock |
|
$0.1600 | Buy Now |
DISTI #
2156-74AUP1G126GN,132-954-ND
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DigiKey | IC BUFFER NON-INVERT 3.6V 6XSON Min Qty: 1920 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
5000 In Stock |
|
$0.1600 | Buy Now |
|
Rochester Electronics | 74AUP1G126GN - Bus Driver, AUP/ULP/V Series, 1-Func, 1-Bit, True Output RoHS: Compliant Status: Active Min Qty: 1 | 5000 |
|
$0.1341 / $0.1578 | Buy Now |
DISTI #
4268979
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Farnell | RoHS: Compliant Min Qty: 2374 Container: Each | 0 |
|
$0.2209 | Buy Now |
Part Details for 74AUP1G126GN,132
74AUP1G126GN,132 CAD Models
74AUP1G126GN,132 Part Data Attributes
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74AUP1G126GN,132
NXP Semiconductors
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Datasheet
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74AUP1G126GN,132
NXP Semiconductors
74AUP1G126 - Low-power buffer/line-driver; 3-state SON 6-Pin
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SON | |
Package Description | 0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, SON-6 | |
Pin Count | 6 | |
Manufacturer Package Code | SOT1115 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 4 Weeks | |
Control Type | ENABLE HIGH | |
Family | AUP/ULP/V | |
JESD-30 Code | R-PDSO-N6 | |
JESD-609 Code | e3 | |
Length | 1 mm | |
Load Capacitance (CL) | 30 pF | |
Logic IC Type | BUS DRIVER | |
Max I(ol) | 0.0017 A | |
Moisture Sensitivity Level | 1 | |
Number of Bits | 1 | |
Number of Functions | 1 | |
Number of Ports | 2 | |
Number of Terminals | 6 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SON | |
Package Equivalence Code | SOLCC6,.04,12 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Prop. Delay@Nom-Sup | 24 ns | |
Propagation Delay (tpd) | 24 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.35 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 0.8 V | |
Supply Voltage-Nom (Vsup) | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.3 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 0.9 mm |