Part Details for 74CBTLV3257QG8 by Integrated Device Technology Inc
Overview of 74CBTLV3257QG8 by Integrated Device Technology Inc
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Communication and Networking
Automotive
Price & Stock for 74CBTLV3257QG8
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Bristol Electronics | Min Qty: 7 | 2715 |
|
$0.1950 / $0.7500 | Buy Now |
|
|
Quest Components | 2172 |
|
$0.2600 / $1.0000 | Buy Now |
Part Details for 74CBTLV3257QG8
74CBTLV3257QG8 CAD Models
74CBTLV3257QG8 Part Data Attributes
|
|
74CBTLV3257QG8
Integrated Device Technology Inc
Buy Now
Datasheet
|
Compare Parts:
74CBTLV3257QG8
Integrated Device Technology Inc
QSOP-16, Reel
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | QSOP | |
| Package Description | SSOP, SSOP16,.25 | |
| Pin Count | 16 | |
| Manufacturer Package Code | PCG16 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Control Type | ENABLE LOW | |
| Count Direction | BIDIRECTIONAL | |
| Family | CBTLV/3B | |
| JESD-30 Code | R-PDSO-G16 | |
| JESD-609 Code | e3 | |
| Length | 4.9 mm | |
| Logic IC Type | BUS EXCHANGER | |
| Moisture Sensitivity Level | 1 | |
| Number of Bits | 2 | |
| Number of Functions | 4 | |
| Number of Ports | 3 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Characteristics | 3-STATE | |
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SSOP | |
| Package Equivalence Code | SSOP16,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, SHRINK PITCH | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power Supply Current-Max (ICC) | 0.01 mA | |
| Prop. Delay@Nom-Sup | 0.15 ns | |
| Propagation Delay (tpd) | 0.25 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.73 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 3.9116 mm |