There are no models available for this part yet.
Overview of 74HCT157BQ,115 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Financial Technology (Fintech)
Computing and Data Storage
Telecommunications
Communication and Networking
Price & Stock for 74HCT157BQ,115 by NXP Semiconductors
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
2156-74HCT157BQ,115-ND
|
DigiKey | IC MULTIPLEXER 4 X 2:1 16DHVQFN Min Qty: 1755 Container: Bulk MARKETPLACE PRODUCT |
2800 In Stock |
|
$0.1700 | Buy Now | |
| Rochester Electronics | 74HCT157BQ - Multiplexer, HCT Series, 4-Func, 2 Line Input, 1 Line Output, True Output, DHVQFN-16 RoHS: Compliant Status: Active Min Qty: 1 | 2800 |
|
$0.1468 / $0.1727 | Buy Now |
CAD Models for 74HCT157BQ,115 by NXP Semiconductors
Part Data Attributes for 74HCT157BQ,115 by NXP Semiconductors
|
|
|
|---|---|
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Rohs Code
|
Yes
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|
Part Life Cycle Code
|
Transferred
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Ihs Manufacturer
|
NXP SEMICONDUCTORS
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Part Package Code
|
QFN
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|
Package Description
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3.50 X 2.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT763-1, VQFN-16
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Pin Count
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16
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Manufacturer Package Code
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SOT763-1
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Reach Compliance Code
|
compliant
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Factory Lead Time
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4 Weeks
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Family
|
HCT
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JESD-30 Code
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R-PQCC-N16
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Length
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3.5 mm
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Load Capacitance (CL)
|
50 pF
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Logic IC Type
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MULTIPLEXER
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Max I(ol)
|
0.004 A
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Moisture Sensitivity Level
|
1
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Number of Functions
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4
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Number of Inputs
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2
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Number of Outputs
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1
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Number of Terminals
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16
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-40 °C
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Output Polarity
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TRUE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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HVQCCN
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Package Equivalence Code
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LCC16,.1X.14,20
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Package Shape
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RECTANGULAR
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Package Style
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CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
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Packing Method
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TR
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Peak Reflow Temperature (Cel)
|
260
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Prop. Delay@Nom-Sup
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41 ns
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Propagation Delay (tpd)
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56 ns
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Qualification Status
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Not Qualified
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Seated Height-Max
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1 mm
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Supply Voltage-Max (Vsup)
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5.5 V
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Supply Voltage-Min (Vsup)
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4.5 V
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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AUTOMOTIVE
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Terminal Form
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NO LEAD
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Terminal Pitch
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0.5 mm
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Terminal Position
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QUAD
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Time@Peak Reflow Temperature-Max (s)
|
30
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Width
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2.5 mm
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