Part Details for 74HCT259BQ,115 by NXP Semiconductors
Overview of 74HCT259BQ,115 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for 74HCT259BQ,115
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-74HCT259BQ,115-954-ND
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DigiKey | NEXPERIA 74HCT259BQ - D LATCH, H Min Qty: 1839 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
2800 In Stock |
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$0.1600 | Buy Now |
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Rochester Electronics | 74HCT259BQ - D Latch, HCT Series, 1-Func, Low Level Triggered, 1-Bit, True Output, DHVQFN-16 RoHS: Compliant Status: Active Min Qty: 1 | 2800 |
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$0.1401 / $0.1648 | Buy Now |
Part Details for 74HCT259BQ,115
74HCT259BQ,115 CAD Models
74HCT259BQ,115 Part Data Attributes
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74HCT259BQ,115
NXP Semiconductors
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Datasheet
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74HCT259BQ,115
NXP Semiconductors
74HC(T)259 - 8-bit addressable latch QFN 16-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFN | |
Package Description | 2.50 X 3.50, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, VQFN-16 | |
Pin Count | 16 | |
Manufacturer Package Code | SOT763-1 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 4 Weeks | |
Additional Feature | 1:8 DMUX FOLLOWED BY LATCH | |
Family | HCT | |
JESD-30 Code | R-PDSO-N16 | |
JESD-609 Code | e4 | |
Length | 3.5 mm | |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | D LATCH | |
Max I(ol) | 0.00002 A | |
Moisture Sensitivity Level | 1 | |
Number of Bits | 1 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVSON | |
Package Equivalence Code | LCC16,.1X.14,20 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Prop. Delay@Nom-Sup | 59 ns | |
Propagation Delay (tpd) | 59 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | NICKEL PALLADIUM GOLD | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Trigger Type | LOW LEVEL | |
Width | 2.5 mm |